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Features:
1.Using higher gold electrode with high reliability, gold, aluminum, silver wire binding
2.Tolerance up to ±0.3%，±1%，±3%
3.High stability, high reliability
4.Small size, the minimum can do 0.3*0.3mm
5.Fast reaction
6.Different sizes and parameters can be customized according to customer requirements
Applications:
1.Infrared thermopile, IGBT, thermosensitive print head, integrated module, semiconductor module, power module
2.Manufacturing temperature sensor
Dimensions:
Package:
Features:
1.Using higher gold electrode with high reliability, gold, aluminum, silver wire binding
2.Tolerance up to ±0.3%，±1%，±3%
3.High stability, high reliability
4.Small size, the minimum can do 0.3*0.3mm
5.Fast reaction
6.Different sizes and parameters can be customized according to customer requirements
Applications:
1.Infrared thermopile, IGBT, thermosensitive print head, integrated module, semiconductor module, power module
2.Manufacturing temperature sensor
Dimensions:
Package:
